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01 ·Scaling & Power·★ MEMBER·11 min read Thermal Design from Scratch — The Wall in 3D Stacking Is Heat Nearly all the power that enters a chip leaves it as heat. Temperature is set by a series stack of thermal resistances, and once you stack dies vertically the hottest layer heats up with the square of the layer count. Heat flux and hotspots, the lag that thermal mass introduces, and which term liquid cooling actually removes — picking up where the power budget left off. 02 ·Device Physics·★ MEMBER·10 min read Reading Chip Design as a Power Budget — The Physics of Leakage and Heat A modern chip is limited not by what fits, but by how much of it can be lit at once. This piece reads that limit as a household budget: dynamic power versus leakage, the positive feedback that makes leakage swell with temperature, the thermal resistance that converts watts into degrees, and the three — and only three — ways a designer can spend the watts.