#packaging

2 articles

01 ·Scaling & Power·★ MEMBER·10 min read The Economics of Chiplets — We Split Dies Because We Cannot Build Them Big Chips are split into chiplets not because splitting is faster but because a single large die cannot be built at a price anyone will pay. The reticle limit, the exponential in yield, cost per good die, the point where splitting starts to lose money, mixing process nodes, and UCIe as a standard for the seam. 02 ·Fabrication & Packaging·FREE·10 min read Advanced Packaging — How CoWoS and HBM Stacking Became the Bottleneck for AI What limited the supply of AI accelerators was not leading-edge logic wafers but the step that puts several finished chips into one part. From the reticle limit and the exponential math of yield, through 2.5D interposers, HBM stacks and TSVs, to hybrid bonding and the bill that heat and warpage send back.