PaperLens
紙
Students
Professional
JA
EN
◐
Sign in with Google
Sign in
Read
Home
Close reading
New
Textbook
Go deeper
Learn
Lab
Landscape
Contributors
Glossary
You
Search
All-access
My Page
#cooling
1 articles
01
2026-08-25
·
Scaling & Power
·
★ MEMBER
·
11 min read
Thermal Design from Scratch — The Wall in 3D Stacking Is Heat
Nearly all the power that enters a chip leaves it as heat. Temperature is set by a series stack of thermal resistances, and once you stack dies vertically the hottest layer heats up with the square of the layer count. Heat flux and hotspots, the lag that thermal mass introduces, and which term liquid cooling actually removes — picking up where the power budget left off.